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  • GB B550 I AORUS PRO AX
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GB B550 I AORUS PRO AX

Záruka: 36 měsíců
Výrobce: Gigabyte
Kód: MBGI0850
P/N: B550 I AORUS PRO AX
Dostupnost: 4 kusy
4 274,33 Kč s DPH
CPU

AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ New Generation AMD Ryzen™ with Radeon™ Graphics processors



Chipset

AMD B550



Memory

2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory

3rd Gen AMD Ryzen™ Processors:

Support for DDR4 4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules

New Generation AMD Ryzen™ with Radeon™ Graphics processors:

Support for DDR4 5300(O.C.)/5200(O.C.)/5000(O.C.)/4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules

Dual channel memory architecture

Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules

Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules

Support for Extreme Memory Profile (XMP) memory modules



Onboard Graphics

Integrated in the New Generation AMD Ryzen™ with Radeon™ Graphics processors:

1 x DisplayPort, supporting a maximum resolution of 5120x2880@60 Hz

Support for DisplayPort 1.4 version, HDCP 2.3, and HDR.

2 x HDMI ports, supporting a maximum resolution of 4096x2160@60 Hz

Support for HDMI 2.1 version, HDCP 2.3, and HDR.

Support for up to 3 displays at the same time

Maximum shared memory of 16 GB



Audio

Realtek® ALC1220-VB codec

The back panel line out jack supports DSD audio.

High Definition Audio

2/4/5.1/7.1-channel

To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.



LAN

Realtek® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)

Wireless Communication module

Intel® Wi-Fi 6 AX200

WIFI a, b, g, n, ac with wave 2 features, ax, supporting 2.4/5 GHz Dual-Band

BLUETOOTH 5

Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

Actual data rate may vary depending on environment and equipment.



Expansion Slots

1 x PCI Express x16 slot (PCIEX16), integrated in the CPU:

3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode

New Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode



Storage Interface

1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2260/2280 SSDs:

3rd Generation AMD Ryzen™ processors support SATA and PCIe 4.0 x4/x2 SSDs

New Generation AMD Ryzen™ with Radeon™ Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs

1 x M.2 connector (M2B_SB) on the back of the motherboard, integrated in the Chipset, supporting Socket 3, M key, type 2260/2280 SSDs:

Supporting SATA and PCIe 3.0 x4/x2 SSDs

4 x SATA 6Gb/s connectors, integrated in the Chipset:

Support for RAID 0, RAID 1, and RAID 10



USB

CPU:

4 x USB 3.2 Gen 1 ports on the back panel

Chipset:

1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support

1 x USB 3.2 Gen 2 Type-A port (red) on the back panel

2 x USB 3.2 Gen 1 ports available through the internal USB header

2 x USB 2.0/1.1 ports available through the internal USB header



Internal I/O Connectors

1 x 24-pin ATX main power connector

1 x 8-pin ATX 12V power connector

1 x CPU fan header

2 x system fan headers

1 x addressable LED strip header

1 x RGB LED strip header

4 x SATA 6Gb/s connectors

2 x M.2 Socket 3 connectors

1 x front panel header

1 x front panel audio header

1 x speaker header

1 x USB 3.2 Gen 1 header

1 x USB 2.0/1.1 header

1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)

1 x Clear CMOS jumper



Back Panel Connectors

1 x DisplayPort

2 x HDMI ports

1 x USB 3.2 Gen 2 Type-A port (red)

4 x USB 3.2 Gen 1 ports

1 x USB Type-C™ port, with USB 3.2 Gen 2 support

1 x Q-Flash Plus button

1 x RJ-45 port

2 x SMA antenna connectors (2T2R)

3 x audio jacks



Operating System

Support for Windows 10 64-bit



Form Factor

Mini-ITX Form Factor; 17.0cm x 17.0cm

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