GB B550 I AORUS PRO AX
Záruka: 36 měsíců
Výrobce: Gigabyte
Kód: MBGI0850
P/N: B550 I AORUS PRO AX
Dostupnost: 4 kusy
4 274,33 Kč s DPH
CPU
AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ New Generation AMD Ryzen™ with Radeon™ Graphics processors
Chipset
AMD B550
Memory
2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
3rd Gen AMD Ryzen™ Processors:
Support for DDR4 4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules
New Generation AMD Ryzen™ with Radeon™ Graphics processors:
Support for DDR4 5300(O.C.)/5200(O.C.)/5000(O.C.)/4866(O.C.)/4600(O.C.)/4400(O.C.)/4000(O.C.)/3600(O.C.)/3333(O.C.)/3200/2933/2667/2400/2133 MHz memory modules
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Onboard Graphics
Integrated in the New Generation AMD Ryzen™ with Radeon™ Graphics processors:
1 x DisplayPort, supporting a maximum resolution of 5120x2880@60 Hz
Support for DisplayPort 1.4 version, HDCP 2.3, and HDR.
2 x HDMI ports, supporting a maximum resolution of 4096x2160@60 Hz
Support for HDMI 2.1 version, HDCP 2.3, and HDR.
Support for up to 3 displays at the same time
Maximum shared memory of 16 GB
Audio
Realtek® ALC1220-VB codec
The back panel line out jack supports DSD audio.
High Definition Audio
2/4/5.1/7.1-channel
To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
LAN
Realtek® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)
Wireless Communication module
Intel® Wi-Fi 6 AX200
WIFI a, b, g, n, ac with wave 2 features, ax, supporting 2.4/5 GHz Dual-Band
BLUETOOTH 5
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Actual data rate may vary depending on environment and equipment.
Expansion Slots
1 x PCI Express x16 slot (PCIEX16), integrated in the CPU:
3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode
New Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode
Storage Interface
1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2260/2280 SSDs:
3rd Generation AMD Ryzen™ processors support SATA and PCIe 4.0 x4/x2 SSDs
New Generation AMD Ryzen™ with Radeon™ Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs
1 x M.2 connector (M2B_SB) on the back of the motherboard, integrated in the Chipset, supporting Socket 3, M key, type 2260/2280 SSDs:
Supporting SATA and PCIe 3.0 x4/x2 SSDs
4 x SATA 6Gb/s connectors, integrated in the Chipset:
Support for RAID 0, RAID 1, and RAID 10
USB
CPU:
4 x USB 3.2 Gen 1 ports on the back panel
Chipset:
1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
2 x USB 2.0/1.1 ports available through the internal USB header
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
2 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
4 x SATA 6Gb/s connectors
2 x M.2 Socket 3 connectors
1 x front panel header
1 x front panel audio header
1 x speaker header
1 x USB 3.2 Gen 1 header
1 x USB 2.0/1.1 header
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x Clear CMOS jumper
Back Panel Connectors
1 x DisplayPort
2 x HDMI ports
1 x USB 3.2 Gen 2 Type-A port (red)
4 x USB 3.2 Gen 1 ports
1 x USB Type-C™ port, with USB 3.2 Gen 2 support
1 x Q-Flash Plus button
1 x RJ-45 port
2 x SMA antenna connectors (2T2R)
3 x audio jacks
Operating System
Support for Windows 10 64-bit
Form Factor
Mini-ITX Form Factor; 17.0cm x 17.0cm